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Thermal Accessories

Wakefield Thermal offers precisions clamps, wedgelocks, front panels, and thermal interface material as a way to complete the packaged solution. Precision clamps are used to secure SCRs and other puck-style devices to the heat sink, and can be combined with the heat sink to form an easy-to-assemble kit. This kit could also include a thermal interface material. The interface material can also be applied to the heat sink prior to shipping to provide greater ease of assembly. Wakefield Thermal does offer a few standard interface materials (grease, epoxy), but we work with all interface material manufacturers and can pre-apply most materials to the heat sink.

Wakefield Thermal also offers a line of wedgelocks which are used with heat frames/conduction plates to provide the necessary clamping force to ensure good thermal transfer. The wedgeslocks are offered in a variety of styles and profiles to suit your application. Just like the clamps, the wedgelocks can be kitted with the heat frames or shipped separately.

Front panels associated with VME, PCI, ATCA, and other industry standards are also available. We stock components from all major manufacturers of electronic packaging which can be installed on the front panels. Front panels can be delivered with or without silk-screening to meet the customer's final needs.

Thermal Interface Material

Thermal Interface Material:

Thermal Interface Materials (TIM) are secondary materials installed between the heat sink and the device that are designed to improve the thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages.

Clamps:

Wakefield Thermal compression pack heat sink and clamp systems provide customers with the complete system solution for proper installation and heat dissipation for high-power compression pack semiconductors. These high-quality mounting clamp assemblies are the industry standard for mounting, compressing, and clamping press-pack SCR, thyristors, rectifiers, and other high power disc packaged devices.

Clamp
Clamp

Clamps:

Wakefield Thermal compression pack heat sink and clamp systems provide customers with the complete system solution for proper installation and heat dissipation for high-power compression pack semiconductors. These high-quality mounting clamp assemblies are the industry standard for mounting, compressing, and clamping press-pack SCR, thyristors, rectifiers, and other high power disc packaged devices.

Bus Bar Kit

Bus Bars & Kits:

Wakefield Thermal offers the SCGB/SCGBK series of standard off the shelf grounding bus bars and kits for various applications. These are variations of UL Listed ground bar kits of different bar sizes, hole sizes, and lug configurations in addition to the many standard kits in stock.

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