Mil/Embedded Solutions

Wakefield Thermal offers extensive expertise in the design, integration and deployment of cooling solutions. Our Applications Engineers work closely with Design Engineers to provide the advantage of sophisticated product design and fast and cost-effective manufacturing capabilities. Our approach ensures that you receive the lowest cost, and highest efficiency solution with a quick turn-around. Our engineers represent decades of design experience across all market sectors. Using the latest software and design technologies, our engineers can take your requirements and develop a specific thermal solution.

We work closely with our clients through the design and development process. And with our worldwide capabilities, we are able to meet critical design timelines and manufacturing requirements.

1. Ejectors & Injectors

2. Wedgelocks

3. Heat Frames

4. Chassis

5. A/H Frames

6. Front Panels

7. Panel Fillers

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Sub Categories

Embedded Cooling

Electronic Packaging Systems

Vacuum & Dip Brazing

MIL/COTS SOLUTIONS
Explore how Wakefield Thermal expertise helps you enable and deploy solutions.

Electronic Packaging Solutions

Wakefield Thermal is a leader in both Thermal Management and Electronic Packaging products with over 60 years of proven experience manufacturing both custom and standard electronic packaging solutions. Wakefield Thermal partnered with Heitec AG, a recognized leader in electronic packaging systems, in June of 2015 in order to provide the North American marketplace with the Heitec product line (formerly Rittal). Thanks to this exclusive strategic partnership, Wakefield Thermal gained the ability to design, manufacture, and modify a customer’s unique specifications within a quick turnaround time.

Wakefield Thermal has achieved a leading position in the Rugged COTS packaging marketplace, providing for VME/VME64x, VXS/VPX, VXI,PXI, AdvancedTCA, and MicroTCA, and CompactPCI/2.16 architectures. We provide customers with our Subracks that feature minimum components for a variety of application options; our multitude of Industrial PCs; our electronic cases that offer a modern design with high functionality; our System Level Packaging that includes VME, CPCI/CPCI Serial, MicroTCA, and Backplanes; our EPS Components for setup, mounting, and upgrade purposes; and so much more.

Embedded Cooling

The engineers over at our Raleigh, North Carolina facility have extensive experience manufacturing milled aluminum heat frames that can be used with electronics to meet or exceed rugged specification requirements.

These high-quality heat frames are CNC precision-machined from durable aluminum or copper solid blocks in order to match with the topography or skyline of the printed circuit board’s specific style for ruggedized applications. The conduction-cooled frames can be combined with thermal-interface material or “gap pads” within the PCB to increase a board’s operating temperature range along with its shock and vibration resistance.

The frames can be integrated with wedgelocks and ejectors to allow VME, cPCI, and other industry specific boards to fit within conduction cooled chassis slots with zero insertion force. Wakefield Thermal's heat frames can be designed in compliance with IEEE 1101.2, VITA 30.1, and VITA 48 (both 0.8” and 1.0” slot pitch) and can also accommodate mezzanine cards as needed. Their available plating options include Chromate, Black Anodize, and Electroless Nickel, and their designs can integrate Front or Rear I/O and can also include Top and Bottom Covers for compliance with Two-Level Maintenance.