Clamps

Wakefield Thermal compression pack heat sink and clamp systems provide customers with the complete system solution for proper installation and heat dissipation for high-power compression pack semiconductors. These high-quality mounting clamp assemblies are the industry standard for mounting, compressing, and clamping press-pack SCR, thyristors, rectifiers, and other high power disc packaged devices. Devices of these styles are most commonly found in power distribution equipment, industrial controls, transportation systems, and power supply and conversion systems.

A clamp system consists of a crossbar and a spring assembly. The crossbar is a steel bar with two threaded rods installed in it. The rods are generally knurled and cold rolled into the bar to ensure proper fit. The cross bar assembly is covered in an epoxy coating, which acts as an electrical insulator to ensure the devices are properly grounded. The crossbar is installed through the center web of the heat sink and sits in a channel surrounded by fins needed for thermal performance.

On the back of the heat sink, a puck style device is installed and then the spring assembly is installed in the threaded rods of the crossbar. By tightening the nuts on the spring assembly, a compression force is applied to the center of the puck. Each spring assembly has a force gauge integrated into it to ensure ease of assembly and consistency of force applied to the many devices used in a system.

The cross bar assembly is available in various lengths to meet the various needs of the industry. All components for device mounting are available separately for all standard compression requirements from 800 lbs. to 16,000 lbs.

Click here to download the Clamps Data Sheet