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Quality Statement
At Wakefield Thermal we are personally committed to never sacrifice safety or quality in our relentless pursuit to: deliver product on time, meet all customer specifications and provide exceptional customer service Our Processes…..We Own Them.
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Product Brochures
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Board Level Power Semiconductor Heat Sinks- Extruded Heat Sinks for Power Semiconductors
- Fan Products
- Heat Pipes
- BGA Thermal Solutions Matrix
- Liquid Cold Plates for High-Performance Components and Systems
- Precision Compression Mounting Clamp Systems
- Stacked Fin Design Guide
- Technical Products
- Thermal Compounds, Adhesives, and Interface Material
- DC/DC Converters
Product Data Sheets
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- BGA Heatsink
- Board Level Heatsink
- BondaTherm Epoxy
- Bonded Fin Heatsink
- Bus Bar and Kits
- DC Fans
- DC to DC Converter Heatsink
- Double Sided Tape
- Extrusion Profile Guide
- Grease
- Heat Pipe Selection and Design Guide
- High Performance Liquid Chillers
- LED Heatsink
- Liquid Cold Plates
- Mil/Embedded
- Phase Change Material
- Skived Fin Heatsink
- Thermoelectric Assemblies - TEMA
- Thermoelectric Cooler
- Universal Joints
- Thermal Vapor Chamber
- Thermal Gap Pads
Technical Data Sheets
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