Wakefield Thermal ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability and custom sizes for your thermal system needs. Thermal Interface Materials (TIM) are a secondary material installed between the heatsink and the device which are designed to improve the thermal transfer to the heatsink. Regardless of how flat or smooth the device and heatsink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages.
Features and Benefits
- Low Thermal Impedance
- Excellent Replacement for Thermal Greases
- Thixotropic / Prevents Compound Run-Out
- Excellent Mechanical & Dielectric Properties
- Cost Effective “Drop in Place” Solution
- RoHS and Halogen Free Compliant
Wakefield Thermal's line of dielectric phase change thermal materials are intended to fill voids between a device and the heatsink and utilizes a polyimide film to act as a thermally conductive carrier in order to deliver a uniform thickness coating of phase-change thermal compound on both sides.
Through the development of this unique formulation, Wakefield Thermal's phase change solution offers efficient thermal transfer by phase-changing during normal device operating temperatures while maintaining a uniform bond line thus driving out the air and adjusting for any surface imperfections or flatness conditions that may exist across the interface. This construction is useful in a wide range of electronic cooling applications from transistors, diodes or any type of heat generating non-isolated power device.
A primary advantage of utilizing a phase-change system is the ability to drive out air from within the interface during initial device cycling causing phase change and surface wetting of the thermal compound coating. The phase-change compound is available in specific die cut patterns for common TO packages and can be placed instantly and immediately ready for component mounting. Due to it’s thixotropic formulation design, compound is held within the interface with no worries of run-out into unwanted areas during normal device/component operation.
Wakefield Thermal's phase-change product is a solvent-free, high performance, dielectric thermal interface material that is designed to provide efficient thermal transfer by providing precision phase-change and a uniform bond line thickness across a device/component mounting interface. The pads are designed as a pre-formed thermally conductive “drop in place” solution that offers excellent thermal transfer characteristics. From an installation perspective, thermal greases are difficult to dispense as well as provide inadequate coverage and a uniform thickness across the interface most often leaving trapped air leading to poor thermal transfer. Not to mention the thermal grease clean up required in unwanted areas afterwards.