Board Level Heatsink Products

Designed with a stamping or extrusion for common package sizes to improve thermal performance.

Board Level Heatsinks

Board Level heat sinks are named as such because they are generally attached both to the device and the PCB. Usually constructed as either a stamping or an extrusion, these heat sinks are designed for common package sizes like T0220, T0247, and D2pak. Stamped heat sinks can have features that clip on to the device so that a screw or secondary clip is not required. Stamped heat sinks have bent/twisted fins to improve the thermal performance in either natural or forced convection. Aluminum stampings are anodized for improved performance in natural convection. If the heat sink is to be mounted to the PCB, then a solderable tab or pin can be attached to the heat sink.

Click here to download the Board Level Heatsink Data Sheet

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